MediaTek announces new 5G chips, can support 200MP camera

MediaTek has today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring new technologies, connectivity, displays, gaming, multimedia and imaging features to premium 5G smartphones. Both chips borrow the technology from MediaTek’s Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the TSMC 5nm production process with an octa-core CPU.

The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz.

Both chips combine an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies. Quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.

The new Dimensity 8000 series also uses MediaTek’s Open Resource Architecture to give device makers the flexibility to customize and differentiate features so they can make 5G smartphones and 5G experiences that truly stand out.

The Dimensity 8000 series integrates MediaTek’s fifth generation AI processing unit, APU 580. The balance of performance and efficiency optimizes AI multimedia, gaming, camera and video experiences.

Powered by a five gigapixel per second image signal processor (ISP), the Dimensity 8000 series produces the fastest, clearest HDR photos and video in its class.

MediaTek also added the 6nm Dimensity 1300 to its 5G family. The…

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